
Contents
page 4 Beckhoff New Automation Technology CB3053
5.4.2 Hard Disk Boot Priority ........................................................................................................ 43
5.5 Advanced Chipset Features ........................................................................................................ 44
5.6 Integrated Peripherals ................................................................................................................. 45
5.6.1 OnChip IDE Devices ........................................................................................................... 46
5.6.2 Onboard Devices ................................................................................................................. 47
5.6.3 SuperIO Devices ................................................................................................................. 48
5.6.4 USB Device Setting ............................................................................................................. 49
5.7 Power Management Setup .......................................................................................................... 50
5.7.1 HPET Feature ..................................................................................................................... 51
5.7.2 Intel DTS Feature ................................................................................................................ 52
5.8 PnP/PCI Configuration ................................................................................................................ 53
5.8.1 IRQ Resources .................................................................................................................... 54
5.9 PC Health Status ......................................................................................................................... 55
5.10 Load Fail-Safe Defaults ............................................................................................................... 57
5.11 Load Optimized Defaults ............................................................................................................. 57
5.12 Set Password .............................................................................................................................. 57
5.13 Save & Exit Setup ....................................................................................................................... 57
5.14 Exit Without Saving ..................................................................................................................... 57
6 BIOS update ....................................................................................................................................... 58
7 Mechanical Drawing ........................................................................................................................... 59
7.1 PCB: Mounting Holes .................................................................................................................. 59
7.2 PCB: Pin 1 Dimensions ............................................................................................................... 60
7.3 PCB: Die Center .......................................................................................................................... 61
8 Technical Data .................................................................................................................................... 62
8.1 Electrical Data ............................................................................................................................. 62
8.2 Environmental Conditions ........................................................................................................... 62
8.3 Thermal Specifications ................................................................................................................ 63
9 Support and Service ........................................................................................................................... 64
9.1 Beckhoff's Branch Offices and Representatives ......................................................................... 64
9.2 Beckhoff Headquarters................................................................................................................ 64
9.2.1 Beckhoff Support ................................................................................................................. 64
9.2.2 Beckhoff Service ................................................................................................................. 64
I Annex: Post-Codes ............................................................................................................................. 65
II Annex: Resources .............................................................................................................................. 68
A IO Range ......................................................................................................................................... 68
B Memory Range ................................................................................................................................ 68
C Interrupt ........................................................................................................................................... 68
D PCI Devices ..................................................................................................................................... 69
E SMB Devices ................................................................................................................................... 69
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